Thermal resistance reduction technology for electronic devices and equipment.
Electronic Patent Technology Trend Survey Report on Heat Resistance Reduction Technology for Electronic Devices and Equipment
You can view patent information categorized by the following technical classifications: - Thermal conductive compositions - Thermal conductive sheets - Heat dissipation structures - Applications characterized by thermal conductivity - Applications characterized by heat dissipation
- Company：データリソース
- Price：100,000 yen-500,000 yen
